TECHNOLOGY

Structure analysis of polishing pads by X-ray CT scan

Nitta Haas Inc. Naoko Kawai, Hiroyuki Nakano, Yasuyuki Itai

In wafer polishing process, the characteristics of polishing pads greatly influence the polishing performance. Therefore, polishing pads are analyzed by various methods such as roughness gauge, SEM, and optical microscope which are used for structure analysis. However, only the surface of polishing pads are analyzed by these devices, so we cannot understand a three-dimensional structure of polishing pads enough. It is important to understand the internal structure of polishing pads in developing a next-generation polishing pad. In this study, we analyzed the void ratio and the glazing state of the polishing pad three-dimensionally by X'ray CT scan.

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