Numerical discussion of polishing mechanism considering contact area of polishing pad and that of polishing abrasives

Nitta Haas Inc. R&D Department , Akira Isobe, Hideaki Nishizawa, Shinichi Haba

Polishing mechanism is discussed based on a model where material is removed atomically at the contact area of abrasives.
Frequency of polishing pad contact area passing at a point on a substrate is calculated and it becomes 1000times per one second. One angstrom of material is removed by 20 passes of the contact. If we assume that one or two lines of abrasives at peripheral of the contact area exists, above removal phenomenon can be well explained.

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