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31.10.2017NHI Exhibits at SEMICON Japan 2017!

Nitta Haas Inc. is going to exhibit at SEMICON Japan 2017, which will take place at Tokyo Big Sight in Tokyo on December 13-15, 2017. This is the largest exhibition in Japan for electronics manufacturing.

We would like to introduce CMP polishing pad and slurry for compound substrate such as SiC, LiTaO3 , and Ga2O3 and demonstrate our innovations which achieved high surface quality such as high removal rate, decrease on surface roughness, and defect free. 

We will continue to contribute innovation by offering polishing solutions which our valued customers require for achieving “Advanced Surface Creation”.

We are looking forward to seeing you at our booth.

SCJapan_org

 


 *SEMICON Japan 2017*
Date:                   December 13 – 15, 2017
Venue:                 Tokyo Big Sight in Tokyo
Booth Number:     3130, East Hall 3
Website:              http://www.semiconjapan.org/jp/
*Please apply for an appointment in advance from the inquiry form at the top page of our website for smooth guidance at SEMICON Japan 2017. 

Contact via e-mail from here:
http://www.nittahaas.com/en/contact/
Allproductswknik

 

 

 

 

*For Inquiries regarding this matter, please feel free to contact us at the below department.

Nitta Haas Incorporated
Business Development Group, Strategic Marketing Dept.
Tel: +81-774-68-1043

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