09.08.2016New Technical Info was Released

At the polishing of silicon wafer that is substrate of semiconductor devices, removal rate is one of key factors. In order to enhance removal rate, we reviewed polishing peformance by each resins which is a raw material of polishing pad, and considered about a mechanism.

 Nitta Haas Inc. will continue to develop polishing technology that contibutes “Advanced Surface Creation” at the polishing of silicon wafer.

※Product for Silicon wafer