Process Of Silicon Wafer

Polycrystalline silicon
Singlecrystalline silicon pulling
Polycrystalline silicon, the raw material for silicon wafers, is melted. After that, single crystalline ingots are completed once a single silicon rod is placed into the molten silicon surface and pulled up.
Slicing
Monocrystalline ingots are sliced into wafers using a slicer or wire saw.
Beveling
Sliced wafers are beveled to control wafer edge chipping and other issues.
Lapping
Both sides of the wafer are then roughly ground to remove the damaged layer and to create smooth thickness.
Etching
The damaged layers which are created by machine processing up to this process, any contaminations and particles which were left on the wafer surface are removed by chemical cleaning.
Annealing
Wafers are annealed to improve surface crystalline perfection which brings stable wafer resistance.

Polishing

Any defects and particles which were created in previous process are removed. In addition, super flat wafers are created by polishing. After the polishing process, wafers are mirrored and without deformation.

Polishing
Cleaning
Inspection
Packing and shipping
CompleteComplete

Polishing of Nitta Haas

In the polishing process, wafer surface is polished with fine particles and polishing pads which are compound with a special felt or plate-shaped pad of several millimeters thickness. Nitta Haas provides major consumable materials such as polishing pads and slurries and fixturing which are used in the polishing process.

Polishing of Nitta Haas
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